The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Feb. 02, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Edward Fuergut, Dasing, DE;

Georg Meyer-Berg, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/4825 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); H01L 23/49562 (2013.01); H01L 23/49844 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 21/568 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/3226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A method of manufacturing a package which comprises encapsulating at least part of an electronic chip by an encapsulant, subsequently covering a part of the electronic chip with a chip attach medium, and attaching the encapsulated electronic chip on a chip carrier via the chip attach medium.


Find Patent Forward Citations

Mahler, Joachim. (2019). Attaching chip attach medium to already encapsulated electronic chip (U.S. Patent No. 10177112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10177112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…