The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Feb. 18, 2016
Infineon Technologies Ag, Neubiberg, DE;
Claus Von Waechter, Sinzing, DE;
Christian Altschaeffl, Vilsheim, DE;
Holger Doepke, Sinzing, DE;
Uwe Hoeckele, Regensburg, DE;
Franz Xaver Muehlbauer, Rimbach, DE;
Daniel Porwol, Straubing, DE;
Tobias Schmidt, Regenstauf, DE;
Christian Schweiger, Pentling, DE;
Carsten Von Koblinski, Villach, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.