Franz Xaver Muehlbauer

Title: Franz Xaver Muehlbauer: Innovator in Adhesive Bonding Technologies

Introduction

Franz Xaver Muehlbauer is a notable inventor based in Rimbach, Germany. He has made significant contributions to the field of adhesive bonding technologies, holding a total of 2 patents. His work focuses on innovative methods and systems that enhance the performance and reliability of various materials.

Latest Patents

Muehlbauer's latest patents include a bonded system and a method for adhesively bonding a hygroscopic material. This bonded system features a reconstituted wafer that includes a hygroscopic material, with a moisture barrier layer arranged over its surface. An adhesive layer is positioned over the moisture barrier, and a carrier is placed over the adhesive layer. This configuration allows for effective adhesion between the reconstituted wafer and the carrier. Another significant patent involves a method of producing a chip package, which describes the process of singulating chips from a wafer and embedding them in encapsulation material.

Career Highlights

Franz Xaver Muehlbauer is currently associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to develop cutting-edge technologies that are crucial for various applications in the electronics industry.

Collaborations

Muehlbauer has collaborated with several talented individuals in his field, including Daniel Porwol and Claus Von Waechter. These collaborations have contributed to the advancement of adhesive bonding technologies and have fostered innovation within the industry.

Conclusion

Franz Xaver Muehlbauer's contributions to adhesive bonding technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and engineering, making him a valuable asset in the field.