Infineon Technologies Ag

Franz Xaver Muehlbauer

Daniel Porwol

Alfons Dehe

Carsten Von Koblinski

Dominic Maier

Thomas Kilger

Uwe Hoeckele

Markus Menath

Tobias Schmidt

Juergen Wagner

Holger Doepke

Claus Von Waechter

Christian Schweiger

Christian Altschaeffl

A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Bonded system and a method for adhesively bonding a hygroscopic material

A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.

Chip package and a method of producing the same

Growing community of inventors

Rimbach, Germany

Franz Xaver Muehlbauer