The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Apr. 26, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Dominic Maier, Pleystein, DE;
Alfons Dehe, Reutlingen, DE;
Thomas Kilger, Regenstauf, DE;
Markus Menath, Regensburg, DE;
Franz Xaver Muehlbauer, Rimbach, DE;
Daniel Porwol, Straubing, DE;
Juergen Wagner, Nittendorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00896 (2013.01); B81C 1/00269 (2013.01); B81C 1/00801 (2013.01); B81C 2201/0194 (2013.01); B81C 2201/053 (2013.01);
Abstract
A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.