The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Apr. 03, 2018
Infineon Technologies Ag, Neubiberg, DE;
Daniel Porwol, Straubing, DE;
Edward Fuergut, Dasing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method for fabricating a semiconductor chip is disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips, wherein each semiconductor chip comprises a first main face, a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on a carrier with the second main faces facing the carrier and applying an encapsulation material by transfer molding thereby forming the semiconductor chip panel, wherein the encapsulation material is applied so that the side faces of the semiconductor chips are covered with the encapsulation material while the first main faces are not.