The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Apr. 17, 2023
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Klaus Elian, Alteglofsheim, DE;

Ludwig Heitzer, Falkenfels, DE;

Fabian Merbeler, Munich, DE;

Matthias Eberl, Taufkirchen, DE;

Thomas Müller, Lappersdorf, DE;

Andreas Allmeier, Pfatter, DE;

Derek Debie, Bogen, DE;

Cyrus Ghahremani, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Christian Irrgang, Sinzing, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 15/06 (2024.01); G01N 15/00 (2006.01); G01H 13/00 (2006.01); G01N 15/02 (2006.01);
U.S. Cl.
CPC ...
G01N 15/0656 (2013.01); G01N 15/00 (2013.01); G01N 15/0606 (2013.01); G01H 13/00 (2013.01); G01N 2015/0046 (2013.01); G01N 15/02 (2013.01); G01N 15/0266 (2013.01);
Abstract

The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.


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