The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Oct. 03, 2007
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.