The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Sep. 11, 2008
Applicants:
Edmund Riedl, Gebelkofen, DE;
Ivan Nikitin, Regensburg, DE;
Johannes Lodermeyer, Regensburg, DE;
Robert Bergmann, Wiesent, DE;
Karsten Guth, Soest, DE;
Inventors:
Edmund Riedl, Gebelkofen, DE;
Ivan Nikitin, Regensburg, DE;
Johannes Lodermeyer, Regensburg, DE;
Robert Bergmann, Wiesent, DE;
Karsten Guth, Soest, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating a semiconductor device. One embodiment provides a metal carrier. A semiconductor chip is provided. A porous layer is produced at a surface of at least one of the carrier and the semiconductor chip. The semiconductor chip is placed on the carrier. The resulting structure is heated until the semiconductor chip is attached to the carrier.