Kallmuenz, Germany

Patrick Schwarz


Average Co-Inventor Count = 9.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2020

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2 patents (USPTO):

Title: Innovations by Patrick Schwarz

Introduction

Patrick Schwarz is an accomplished inventor based in Kallmuenz, Germany. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to manufacturing and design.

Latest Patents

Schwarz's latest patents include a metallic interconnect and a method of manufacturing a metallic interconnect, as well as a semiconductor arrangement and a method of manufacturing a semiconductor arrangement. The metallic interconnection involves a process that includes providing a first structure with a first metallic layer featuring protruding microstructures, and a second structure with a second metallic layer also having protruding microstructures. These structures are mechanically connected to allow fluid penetration, followed by the removal of non-metallic compounds using a reducing agent. The process concludes with heating the layers to facilitate interdiffusion, forming a robust metallic interconnection. His semiconductor device patent describes a configuration where a thermoresistive element is thermally connected to a semiconductor portion, significantly enhancing performance above specified maximum operation temperatures.

Career Highlights

Patrick Schwarz is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work focuses on advancing technologies that improve the efficiency and functionality of semiconductor devices.

Collaborations

Throughout his career, Schwarz has collaborated with notable colleagues such as Joachim Mahler and Johannes Georg Laven, contributing to various innovative projects within the semiconductor industry.

Conclusion

Patrick Schwarz's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the field. His advancements in metallic interconnects and semiconductor arrangements are paving the way for future developments in the industry.

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