The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Apr. 23, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Stefan Schwab, Regensburg, DE;
Edmund Riedl, Wald, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/42 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/54 (2013.01); H01L 21/565 (2013.01); H01L 23/42 (2013.01); H01L 23/49575 (2013.01);
Abstract
A structure includes a first sub-structure and a second sub-structure coupled with the first sub-structure and being a composite including filler particles in a matrix. A surface of the first sub-structure has a surface profile with first elevations and first recesses configured to enable at least part of the filler particles to at least partially enter the first recesses to thereby form an interlayer including the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure.