Wuppertal, Germany

Stefan Schwab

This inventor holds 3 USPTO granted patents and 10 published patent applications and 1 EPO patent. Top assignee: Infineon Technologies Ag. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stefan Schwab. Retrieved from https://idiyas.com/inventor/stefan-schwab-as60w48u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2024

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Stefan Schwab

Introduction

Stefan Schwab is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of electronic component packaging. With a total of 3 patents to his name, Schwab continues to push the boundaries of innovation in his industry.

Latest Patents

One of Schwab's latest patents focuses on mold compounds and packages for encapsulating electronic components. This patent discloses a package and method of manufacturing a package that includes a first cured mold compound. The first cured mold compound consists of a resin and filler particles embedded within it. Notably, the filler particles include a second cured mold compound, which is based on a different curing act than the first.

Another significant patent involves an interlayer of sub-structure having elevations and a further sub-structure with filler particles in recesses between the elevations. This structure comprises a first sub-structure and a second sub-structure that is coupled with the first. The composite includes filler particles in a matrix, allowing for a unique surface profile that enhances the functionality of electronic components.

Career Highlights

Stefan Schwab is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to develop innovative technologies that are crucial for modern electronics.

Collaborations

Throughout his career, Schwab has collaborated with talented individuals such as Richard Knipper and Alexander Heinrich. These collaborations have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies.

Conclusion

Stefan Schwab's contributions to the field of electronic component packaging are noteworthy. His innovative patents and collaborations highlight his commitment to advancing technology. As he continues to work at Infineon Technologies AG, the impact of his inventions will likely resonate throughout the industry for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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