The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Oct. 15, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andreas Waterloo, Regensburg, DE;
Stefan Schwab, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 101/12 (2006.01); C08K 9/12 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08L 101/12 (2013.01); H01L 23/295 (2013.01);
Abstract
A package and method of manufacturing a package is disclosed. In one example, a package for encapsulating an electronic component includes a first cured mold compound, wherein the first cured mold compound includes a resin and filler particles embedded in the resin. The filler particles include a second cured mold compound. The first cured mold compound is based on a first curing act and the second cured mold compound is based on a second curing act different from the first curing act.