Infineon Technologies Ag

Stefan Schwab

Alexander Heinrich

Thorsten Scharf

Edmund Riedl

Martin Mayer

Richard Knipper

Andreas Waterloo

A package and method of manufacturing a package is disclosed. In one example, a package for encapsulating an electronic component includes a first cured mold compound, wherein the first cured mold compound includes a resin and filler particles embedded in the resin. The filler particles include a second cured mold compound. The first cured mold compound is based on a first curing act and the second cured mold compound is based on a second curing act different from the first curing act.

Mold compounds and packages for encapsulating electronic components

A structure includes a first sub-structure and a second sub-structure coupled with the first sub-structure and being a composite including filler particles in a matrix. A surface of the first sub-structure has a surface profile with first elevations and first recesses configured to enable at least part of the filler particles to at least partially enter the first recesses to thereby form an interlayer including the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure.

Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations

A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.

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Wuppertal, Germany

Stefan Schwab