The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Nov. 30, 2009
Applicants:
Alexander Heinrich, Regensburg, DE;
Thorsten Scharf, Regensburg, DE;
Edmund Riedl, Gebelkofen, DE;
Steffan Jordan, Viehhausen, DE;
Inventors:
Alexander Heinrich, Regensburg, DE;
Thorsten Scharf, Regensburg, DE;
Edmund Riedl, Gebelkofen, DE;
Steffan Jordan, Viehhausen, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.