The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Mar. 16, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Edmund Riedl, Wald, DE;
Wu Hu Li, Singapore, SG;
Alexander Heinrich, Bad Abbach, DE;
Ralf Otremba, Kaufbeuren, DE;
Werner Reiss, Raubling, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 35/268 (2013.01); B23K 35/282 (2013.01); B23K 35/288 (2013.01); H01L 23/49866 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); B23K 2101/38 (2018.08); H01L 2224/04026 (2013.01); H01L 2224/04034 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/27614 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83024 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84009 (2013.01); H01L 2224/84065 (2013.01); H01L 2224/84801 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/05432 (2013.01);
Abstract
A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.