The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Nov. 22, 2013
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Manfred Mengel, Bad Abbach, DE;

Edward Fürgut, Dasing, DE;

Ralf Otremba, Kaufbeuren, DE;

Jürgen Högerl, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2924/13055 (2013.01);
Abstract

An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery, wherein at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure comprises electrically conductive inserts in an electrically insulating matrix.


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