The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Sep. 30, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Edward Fuergut, Dasing, DE;
Manfred Mengel, Bad Abbach, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3142 (2013.01); H01L 23/3675 (2013.01); H01L 23/4334 (2013.01); H01L 21/565 (2013.01); H01L 23/3737 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
Method for manufacturing an electronic semiconductor package, in which method an electronic chip () is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings.