The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Dec. 23, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Manfred Mengel, Bad Abbach, DE;

Khalil Hosseini, Weihmichl, DE;

Klaus Schmidt, Nittendorf, DE;

Franz-Peter Kalz, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/00 (2013.01); H01L 24/24 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2499 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24246 (2013.01); H01L 2224/26165 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/82002 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82345 (2013.01); H01L 2224/82385 (2013.01); H01L 2224/82986 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.


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