The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Nov. 26, 2008
Applicants:
Soon Lock Goh, Mutiara, MY;
Chau Fatt Chiang, Melaka, MY;
Inventors:
Soon Lock Goh, Mutiara, MY;
Chau Fatt Chiang, Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the carrier that undercuts the bump. A semiconductor chip is attached to the carrier. The chip is electrically connected to the bump. An encapsulant is deposited into the gap. The carrier is removed from the bump.