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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9852918 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Aug. 26, 2015

Embedding additive particles in encapsulant of electronic device

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Peh Hean Teh, Melaka, MY;

Jagen Krishnan, Muar, MY;

Swee Kah Lee, Melaka, MY;

Poh Cheng Lim, Melaka, MY;

Joachim Mahler, Regensburg, DE;

Chew Theng Tai, Melaka, MY;

Yik Yee Tan, Melaka, MY;

Soon Lock Goh, Malacca, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:

Khaja Ahmad

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/3105 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3105 (2013.01); C09J 163/00 (2013.01); H01L 21/56 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/49548 (2013.01); H01L 23/49555 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8392 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

Find Patent Forward Citations

Teh, Peh. (2017). Embedding additive particles in encapsulant of electronic device (U.S. Patent No. 9852918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9852918

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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