The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Oct. 19, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Chau Fatt Chiang, Melaka, MY;
Kok Yau Chua, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Chee Yang Ng, Johor, MY;
Valentyn Solomko, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/367 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.