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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10631100 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Sep. 12, 2018

Micro-electrical mechanical system sensor package and method of manufacture thereof

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Chau Fatt Chiang, Melaka, MY;

Kok Yau Chua, Melaka, MY;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Curtis A Kuntz

Assistant Examiner:

Julie X Dang

Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/04 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/04 (2013.01); B81C 1/00214 (2013.01); H04R 19/005 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/096 (2013.01); B81C 2203/0792 (2013.01); H04R 2201/003 (2013.01);
Abstract

A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall attaching the first sidewall to the second sidewall; and a first contact pad disposed on an exterior surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.

Find Patent Forward Citations

Chiang, Chau. (2020). Micro-electrical mechanical system sensor package and method of manufacture thereof (U.S. Patent No. 10631100). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10631100

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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