The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Mar. 18, 2015
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Fabio Brucchi, Villach, AT;

Teck Sim Lee, Melaka, MY;

Xaver Schloegel, Sachsenkam, DE;

Franz Stueckler, St.Stefan, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/522 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/565 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 23/49589 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19101 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A power semiconductor device is provided. The power semiconductor device includes a leadframe, which includes a first chip carrier part and at least one second chip carrier part, which are fitted at a distance from one another and are in each case electrically conductive, at least one first power semiconductor component applied on the first chip carrier part, at least one second power semiconductor component applied on the second chip carrier part, external contacts in the form of external leads, and a capacitor. The capacitor is mounted on two adjacent external leads.


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