The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Aug. 22, 2023
Infineon Technologies Austria Ag, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Thai Kee Gan, Melaka, MY;
Teck Sim Lee, Melaka, MY;
Chwee Pang Tommy Khoo, Melaka, MY;
Christian Schiele, Munich, DE;
Katrin Unterhofer, Munich, DE;
Patrick Uredat, Munich, DE;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A power semiconductor package includes: a die carrier having first and second opposite sides; and first and second power semiconductor dies each having first and second power electrodes on opposite sides. The second power electrodes face and are electrically coupled to the first side of the carrier. A molded body at least partially encapsulates the dies and has a first and second opposite sides and lateral sides connecting the first and second sides. First and second power contacts and first and second control contacts are arranged laterally next to each other. The first power electrode of the first die is electrically coupled to the first power contact by a first electrical connector. The first power electrode of the second die is electrically coupled to the second power contact by a second electrical connector. A width of each power contact is at least four times the width of each control contact.