The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Oct. 15, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Edward Fuergut, Dasing, DE;

Chii Shang Hong, Melaka, MY;

Teck Sim Lee, Melaka, MY;

Bernd Schmoelzer, Radenthein, AT;

Ke Yan Tean, Melaka, MY;

Lee Shuang Wang, Melaka, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/56 (2013.01); H01L 23/49506 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49568 (2013.01); H01L 23/49838 (2013.01); H01L 24/46 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.


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