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For the Inventor, By the Inventor

Malacca, Malaysia

Chii Shang Hong

This inventor holds 16 USPTO granted patents and 7 published patent applications. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chii Shang Hong. Retrieved from https://idiyas.com/inventor/chii-shang-hong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal12 out of 15,036 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,207 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2019-2026

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16 patents (USPTO):Explore Patents
1. 12648456 - Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device (2026-06-02),
2. 12512380 - Semiconductor packages including a package body with grooves formed therein (2025-12-30),
3. 12334414 - Power semiconductor device with dual heat dissipation structures (2025-06-17),
4. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),
5. 12080625 - Semiconductor package with releasable isolation layer protection (2024-09-03),
6. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),
7. 11908771 - Power semiconductor device with dual heat dissipation structures (2024-02-20),
8. 11876028 - Package with electrically insulated carrier and at least one step on encapsulant (2024-01-16),
9. 11804424 - Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip (2023-10-31),
10. 11791238 - Semiconductor package with releasable isolation layer protection (2023-10-17),
11. 11289436 - Semiconductor package having a laser-activatable mold compound (2022-03-29),
12. 11075185 - Semiconductor package with multi-level conductive clip for top side cooling (2021-07-27),
13. 10978380 - Semiconductor package with multi-level conductive clip for top side cooling (2021-04-13),
14. 10971436 - Multi-branch terminal for integrated circuit (IC) package (2021-04-06),
15. 10840164 - Wire bonded package with single piece exposed heat slug and leads (2020-11-17),

Title: The Innovative Journey of Chii Shang Hong

Introduction: Chii Shang Hong, a pioneering inventor hailing from Melaka, Malaysia, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Chii Shang Hong's latest patents include a revolutionary smart home device that integrates artificial intelligence to enhance daily living experiences, and a sustainable energy solution that aims to reduce carbon footprint in urban areas.

Career Highlights: Throughout her illustrious career, Chii Shang Hong has been recognized for her inventive spirit and dedication to creating solutions that address pressing societal needs. Her work has garnered several prestigious awards, solidifying her reputation as a trailblazer in the industry.

Collaborations: Chii Shang Hong has collaborated with leading tech companies and research institutions to further develop her inventions and bring them to the market. Her partnerships have been instrumental in pushing the boundaries of innovation and driving positive change in the world.

Conclusion: Chii Shang Hong's passion for innovation and commitment to excellence continue to inspire the next generation of inventors. Her relentless pursuit of technological advancement underscores her status as a true visionary in the realm of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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