The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Jun. 13, 2019
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Stoek, Buxtehude, DE;
Chii Shang Hong, Melaka, MY;
Chiew Li Tai, Melaka, MY;
Edmund Sales Cabatbat, Roxas, PH;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/49589 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An example multi-branch terminal for an integrated circuit (IC) package is described herein. An example multi-branch terminal of an integrated circuit (IC), may include a first branch that may include an active bonding with a chip of the IC, wherein the active bonding may include a wire bonded to the chip of the IC; and a second branch that may include a passive bonding with the chip of the IC, wherein the passive bonding may include a capacitor bonded to the second branch and a first terminal of the IC.