This inventor holds 7 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Infineon Technologies Ag, Cree Gmbh, Infineon Technologies Austria Ag. Active years: 2018-2023.
Company Filing History:
5 out of 15,016 
1 out of 2,307 
1 out of 2,195 Years Active: 2018-2023
Title: Chiew Li Tai: Innovator in Semiconductor Technology
Introduction
Chiew Li Tai is a prominent inventor based in Melaka, Malaysia, known for his significant contributions to semiconductor technology. With a total of 7 patents to his name, he has made remarkable advancements in the field, particularly in methods for processing semiconductor wafers and innovative semiconductor packages.
Latest Patents
Chiew Li Tai's latest patents include a method for processing a semiconductor wafer, which involves generating defects within the wafer to define a detachment plane. This method allows for the creation of electronic semiconductor components while ensuring the integrity of the wafer. Another notable patent is for a semiconductor package featuring a multi-level conductive clip designed for top-side cooling. This package includes a die pad, a semiconductor die, and an interconnect clip that enhances the efficiency of heat dissipation.
Career Highlights
Throughout his career, Chiew Li Tai has worked with leading companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies Austria AG. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.
Collaborations
Chiew Li Tai has collaborated with notable professionals in the field, including Chii Shang Hong and Edmund Sales Cabatbat. These collaborations have further enriched his work and expanded the impact of his inventions.
Conclusion
Chiew Li Tai's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor processing and packaging, showcasing the importance of innovation in technology.