The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Jan. 23, 2017
Infineon Technologies Ag, Neubiberg, DE;
Mohd Kahar Bajuri, Melaka, MY;
Edmund Sales Cabatbat, Roxas, PH;
Gaylord Evangelista Cruz, Muntinlupa, PH;
Amirul Afiq Hud, Melaka, MY;
Teck Sim Lee, Melaka, MY;
Norbert Joson Santos, Baguio, PH;
Chiew Li Tai, Melaka, MY;
Chin Wei Yang, Seremban, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.