Melaka, Malaysia

Mohd Kahar Bajuri

USPTO Granted Patents = 5 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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5 patents (USPTO):

Title: Innovator Spotlight: Mohd Kahar Bajuri and His Contributions to Semiconductor Technology

Introduction: Mohd Kahar Bajuri is an accomplished inventor based in Melaka, Malaysia, known for his significant contributions to semiconductor technology. With a total of five patents to his name, he is recognized for his innovative advancements that enhance the efficiency and effectiveness of semiconductor packages.

Latest Patents: Among his notable inventions, Mohd Kahar Bajuri's latest patents focus on semiconductor packages with wire bond joints. One such patent describes a semiconductor package that includes a semiconductor die attached to a leadframe, alongside a metal clip that is bonded to the die using multiple wire bonds. These bonds form a critical joint between the semiconductor die and the metal clip. His work also outlines methods of manufacturing these semiconductor packages, emphasizing the precision in aligning bonding regions and forming wire bonds through openings in the metal clip.

Career Highlights: Mohd Kahar Bajuri is currently a part of Infineon Technologies AG, a company known for its innovative efforts in semiconductor manufacturing and technology. His experience and creativity have contributed to the development of efficiency and functionality in semiconductor devices, solidifying his status in the industry.

Collaborations: Throughout his career, Mohd Kahar Bajuri has collaborated with celebrated colleagues such as Joel Feliciano Del Rosario and Thai Kee Gan. These collaborations have enabled the exchange of ideas and expertise, further advancing their projects in semiconductor technology.

Conclusion: Mohd Kahar Bajuri's dedication to innovation in the semiconductor field positions him as a prominent figure in technology development. His patents and collaborative efforts not only enhance the efficiency of semiconductor packages but also pave the way for future advancements in the industry.

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