The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Oct. 09, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Kar Meng Ho, Ipoh, MY;

Chiew Li Tai, Melaka, MY;

Jia Yi Wong, Melaka, MY;

Sanjay Kumar Murugan, Melaka, MY;

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/047 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 21/481 (2013.01); H01L 21/4814 (2013.01); H01L 23/047 (2013.01); H01L 23/14 (2013.01); H01L 23/315 (2013.01); H01L 23/367 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/49111 (2013.01);
Abstract

A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.


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