The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Nov. 11, 2020
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Edward Fuergut, Dasing, DE;

Peter Friedrichs, Nuremberg, DE;

Ralf Otremba, Kaufbeuren, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0635 (2013.01); H01L 23/31 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/78 (2013.01);
Abstract

A semiconductor chip includes a semiconductor body having a main surface and a rear surface opposite the main surface, a first bond pad disposed on the main surface, a second bond pad disposed on the rear surface, a first switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the first bond pad, and a second switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the second bond pad.


Find Patent Forward Citations

Loading…