The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
May. 12, 2023
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Timo Bohnenberger, Neutraubling, DE;
Alexander Roth, Zeitlarn, DE;
Alexander Heinrich, Bad Abbach, DE;
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG, VILLACH, AT;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10W 40/735 ; H10W 40/22 ; H10W 95/00 ; H10W 90/00 ; H10W 40/258 ; H10W 40/037 ; H10W 40/20 ; H10W 40/255 ;
Bohnenberger, Timo. (2026). Power semiconductor module arrangement comprising heat-conducting layer and heat sink and method for producing the same (U.S. Patent No. 12713920). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713920
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile