The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Oct. 19, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Stefan Schwab, Regensburg, DE;
Alexander Roth, Zeitlarn, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4814 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 23/49506 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49586 (2013.01);
Abstract
An integrated circuit package that includes a leadframe and a mold compound encapsulating at least a portion of the leadframe. The mold compound includes a cavity open at a bottom surface of the mold compound that exposes a bottom surface of the leadframe. A thermally conductive and electrically insulating isolation layer is locked within the bottom cavity of the mold compound and contacts the bottom surface of the leadframe.