The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
May. 11, 2023
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/84 (2013.01); H01L 2224/84359 (2013.01); H01L 2224/84825 (2013.01);
Abstract
A method of producing a semiconductor device includes providing a semiconductor die, providing a metal joining partner, forming a diffusion solderable region by an inkjet metal printing process, forming an assembly to include the diffusion solderable region in between the metal joining partner and the semiconductor die, and performing a diffusion soldering process that forms a soldered joint from the diffusion solderable region in between the semiconductor die and the metal joining partner.