Daniel Pedone

Title: The Innovative Contributions of Daniel Pedone

Introduction

Daniel Pedone is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

Among his latest patents is a semiconductor package and method for fabricating a semiconductor package. This invention includes a power semiconductor chip made of silicon carbide (SiC) and a leadframe part composed of copper (Cu). The design features a solder joint that electrically and mechanically couples the power semiconductor chip to the leadframe part, incorporating at least one intermetallic phase. Another recent patent is for a linear spacer used for spacing a carrier of a package. This package is designed for mounting on a base and includes a carrier, an electronic component mounted on the carrier, and leads that are electrically coupled with the electronic component and the mounting base.

Career Highlights

Daniel Pedone has worked with prominent companies in the semiconductor industry, including Infineon Technologies Austria AG and Infineon Technologies AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Daniel has collaborated with esteemed colleagues such as Ralf Otremba and Joachim Mahler. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Daniel Pedone's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively.