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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11688670 B1

PDFFull Text
Date of Patent:
Jun. 27, 2023

Filed:

Oct. 26, 2020

Semiconductor package and method for fabricating a semiconductor package

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Paul Frank, Villach, AT;

Alexander Heinrich, Bad Abbach, DE;

Alexandra Ludsteck-Pechloff, Unterhaching, DE;

Daniel Pedone, Munich, DE;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Dale E Page

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/283 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 21/78 (2013.01); H01L 23/49579 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A semiconductor package includes a power semiconductor chip comprising SiC, a leadframe part comprising Cu, wherein the power semiconductor chip is arranged on the leadframe part, and a solder joint electrically and mechanically coupling the power semiconductor chip to the leadframe part, wherein the solder joint comprises at least one intermetallic phase.

Find Patent Forward Citations

Otremba, Ralf. (2023). Semiconductor package and method for fabricating a semiconductor package (U.S. Patent No. 11688670). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688670

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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