The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Dec. 19, 2023
Infineon Technologies Austria Ag, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Edward Fürgut, Dasing, DE;
Uwe Kirchner, Witra, AT;
Leo Aichriedler, Puch, AT;
Florian Lindner, Munich, DE;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A molded surface mount package includes: a power semiconductor die attached to a metallic pad with a first side facing the pad and a second (opposite) side facing away from the pad, the metallic pad forming a first power terminal exposed at a surface mounting side of the package; a second power terminal, a first sense terminal, and a gate terminal each exposed at the surface mounting side and spaced apart from the first power terminal; a first electrical connection between the second power terminal and a first power pad at the second side of the die; a second electrical connection between the gate terminal and a gate pad at the second side of the die; a third electrical connection between the first sense terminal and a first sense pad at the second side of the die; and a first redundant electrical connection for the second or third electrical connection.