The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Oct. 09, 2020
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Wen Hung Huang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01);
Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a first conductive component, a second conductive component, a planarization layer and an antenna layer. The second conductive component is disposed adjacent to the first conductive component. The second conductive component and the first conductive component have different thicknesses. The planarization layer is disposed on the first conductive component. The antenna layer is disposed on the first conductive component and the second conductive component.