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Kaohsiung, Taiwan

Chih-Cheng Lee

USPTO Granted Patents = 67 (Patent Applications = 12)

Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 86(Granted Patents)

Forward Citations (Not Self Cited) = 77(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Taipei County, TW (2012)
Banchiao, TW (2012 - 2020)
Kaohsiung, TW (2013 - 2024)

Company Filing History:

66 out of 1,872

Advanced Semiconductor Engineering, Inc.

where one patent can have more than one assignee

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Device Package

Electronic Assembly

Package Substrate

Stress Buffering Layer

Substrate Structure

Antenna Package

Conductive Structure

Embedded Component Package

Dielectric Layers

Electrical Connection Placement

Reduced-Dimension Via-Land Structure

Semiconductor Manufacturing Process

67 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12451415 - Semiconductor device package, electronic assembly and method for manufacturing the same (2025-10-21),

2. 12388001 - Electronic package (2025-08-12),

3. 12315828 - Package substrate, electronic device package and method for manufacturing the same (2025-05-27),

4. 12300677 - Semiconductor device package including stress buffering layer (2025-05-13),

5. 12224481 - Semiconductor device package and method of manufacturing the same (2025-02-11),

6. 12165963 - Substrate, semiconductor device package and method of manufacturing the same (2024-12-10),

7. 12040287 - Semiconductor device package and method for manufacturing the same (2024-07-16),

8. 11997798 - Package substrate and method for manufacturing the same (2024-05-28),

9. 11830834 - Semiconductor device, semiconductor device package and method of manufacturing the same (2023-11-28),

10. 11824031 - Semiconductor package structure with dielectric structure covering upper surface of chip (2023-11-21),

11. 11776885 - Substrate, semiconductor device package and method of manufacturing the same (2023-10-03),

12. 11764137 - Semiconductor device package, electronic assembly and method for manufacturing the same (2023-09-19),

13. 11721678 - Semiconductor device package including stress buffering layer (2023-08-08),

14. 11600901 - Semiconductor device package and method of manufacturing the same (2023-03-07),

15. 11600567 - Semiconductor device package and method for manufacturing the same (2023-03-07),

Title: The Innovative Journey of Chih-Cheng Lee

Introduction: Chih-Cheng Lee, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chih-Cheng Lee holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on advanced semiconductor technology for mobile devices.

Career Highlights: Throughout his illustrious career, Chih-Cheng Lee has worked with leading tech companies to develop cutting-edge solutions. His expertise in semiconductor design and wireless communication systems has led to the creation of innovative products that have revolutionized the industry.

Collaborations: Chih-Cheng Lee has collaborated with top researchers and engineers from around the world, fostering a culture of innovation and excellence. His partnerships have resulted in the successful development of next-generation technologies that have set new standards in the field.

Conclusion: Chih-Cheng Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

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