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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chih-Cheng Lee

This inventor holds 72 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Cheng Lee. Retrieved from https://idiyas.com/inventor/chih-cheng-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 72 

% Patents Active = 86.1

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 102(Granted Patents)

Forward Citations (Not Self Cited) = 77(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taipei County, TW (2012)
  • Banchiao, TW (2012 - 2020)
  • Kaohsiung, TW (2013 - 2024)

Company Filing History:

goldMedal71 out of 1,964 
 
Advanced Semiconductor Engineering, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Device Package
Manufacturing Method
Package Structure
Electronic Assembly
Substrate Structure
Stress Buffering Layer
Antenna Package
Electrical Connection Placement
Dielectric Structure
3D Packaging
Thermal Management
72 patents (USPTO):Explore Patents
1. 12721204 - Method for manufacturing a package structure (2026-08-25),
2. 12642109 - Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads (2026-05-26),
3. 12616030 - Electronic device and method for manufacturing the same (2026-04-28),
4. 12550663 - Method and equipment for manufacturing a package structure (2026-02-10),
5. 12538817 - Semiconductor device package and method of manufacturing the same (2026-01-27),
6. 12451415 - Semiconductor device package, electronic assembly and method for manufacturing the same (2025-10-21),
7. 12388001 - Electronic package (2025-08-12),
8. 12315828 - Package substrate, electronic device package and method for manufacturing the same (2025-05-27),
9. 12300677 - Semiconductor device package including stress buffering layer (2025-05-13),
10. 12224481 - Semiconductor device package and method of manufacturing the same (2025-02-11),
11. 12165963 - Substrate, semiconductor device package and method of manufacturing the same (2024-12-10),
12. 12040287 - Semiconductor device package and method for manufacturing the same (2024-07-16),
13. 11997798 - Package substrate and method for manufacturing the same (2024-05-28),
14. 11830834 - Semiconductor device, semiconductor device package and method of manufacturing the same (2023-11-28),
15. 11824031 - Semiconductor package structure with dielectric structure covering upper surface of chip (2023-11-21),

Title: The Innovative Journey of Chih-Cheng Lee

Introduction: Chih-Cheng Lee, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chih-Cheng Lee holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on advanced semiconductor technology for mobile devices.

Career Highlights: Throughout his illustrious career, Chih-Cheng Lee has worked with leading tech companies to develop cutting-edge solutions. His expertise in semiconductor design and wireless communication systems has led to the creation of innovative products that have revolutionized the industry.

Collaborations: Chih-Cheng Lee has collaborated with top researchers and engineers from around the world, fostering a culture of innovation and excellence. His partnerships have resulted in the successful development of next-generation technologies that have set new standards in the field.

Conclusion: Chih-Cheng Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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