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For the Inventor, By the Inventor

San Jose, CA, United States of America

Qing Ma

This inventor holds 150 USPTO granted patents and 5 published patent applications and 9 EPO patents, primarily in Integrated Circuit Packaging (CPC class H01L23-49827). Top assignees: Intel Corporation, Nanochip, Inc., Other. Active years: 2000-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qing Ma. Retrieved from https://idiyas.com/inventor/qing-ma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 150 

% Patents Active = 54.7


Average Co-Inventor Count = 2.5

ph-index = 32

Forward Citations = 4,620(Granted Patents)

Forward Citations (Not Self Cited) = 4,363(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Santa Clara, CA (US) (2008)
  • San Jose, CA (US) (2000 - 2019)
  • Saratoga, CA (US) (2012 - 2019)

Company Filing History:

goldMedal148 out of 56,365 
 
Intel Corporation
 patents
silverMedal1 out of 13 
 
Nanochip, Inc.
 patents
bronzeMedal1 out of 834,570 
Other
 patents

Years Active: 2000-2019

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Areas of Expertise:
Integrated Circuit
MEMS Switch
Microelectronic Structures
Glass Substrate
High Density Packaging
Biosensor
Ferroelectric Memory
Accelerometer
Chemical Analysis
Energy Harvesting
Interposer
Debond Interconnect
150 patents (USPTO):Explore Patents
1. 10508961 - Semiconductor package with air pressure sensor (2019-12-17),
2. 10453635 - Package MEMS switch and method (2019-10-22),
3. 10156583 - Method of making an accelerometer (2018-12-18),
4. 10070524 - Method of making glass core substrate for integrated circuit devices (2018-09-04),
5. 10008452 - Microelectronic structures having laminated or embedded glass routing structures for high density packaging (2018-06-26),
6. 9793201 - Glass clad microelectronic substrate (2017-10-17),
7. 9761514 - Substrate for integrated circuit devices including multi-layer glass core and methods of making the same (2017-09-12),
8. 9691579 - Package MEMS switch and method (2017-06-27),
9. 9686861 - Glass core substrate for integrated circuit devices and methods of making the same (2017-06-20),
10. 9674945 - Heterogeneous integration of microfluidic devices in package structures (2017-06-06),
11. 9673131 - Integrated circuit package assemblies including a glass solder mask layer (2017-06-06),
12. 9642248 - Microelectronic structures having laminated or embedded glass routing structures for high density packaging (2017-05-02),
13. 9617148 - Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips (2017-04-11),
14. 9461010 - Debond interconnect structures (2016-10-04),
15. 9445496 - Glass clad microelectronic substrate (2016-09-13),

Title: Qing Ma: Innovations in Semiconductor Packaging and MEMS Switches

Introduction:

Qing Ma, a prolific inventor based in San Jose, CA, has made significant contributions to the field of semiconductor packaging and microelectromechanical systems (MEMS) switches. With an impressive portfolio of 150 patents, Ma has demonstrated expertise in developing advanced technologies for the electronics industry. This article explores Ma's latest patents, career highlights, notable collaborations, and the impact of his innovations.

Latest Patents:

Ma's recent patents showcase his expertise in the field of semiconductor packaging and MEMS switches. One notable invention is a semiconductor package with an air pressure sensor. The patent describes a semiconductor package comprising multiple build-up layers and a cavity embedded within these layers. An air pressure sensor is integrated into the package, utilizing the cavity and an electrode placed above it. This innovation has the potential to enhance the functionality and reliability of semiconductor devices.

Additionally, Ma has developed methods for forming semiconductor packages with air pressure sensors. These methods provide insights into the fabrication process and highlight Ma's commitment to advancing manufacturing techniques in the electronics industry.

Another significant patent credited to Ma is the development of an electronic device with a switch formed in a chip package. This invention emphasizes the utilization of a polymer-based dielectric for the switch, showcasing Ma's proficiency in exploring novel materials for MEMS structures. The patent encompasses various types of switches, including cantilever switches and shunt switches, which can enable improved device performance and efficiency.

Career Highlights:

Qing Ma's career includes notable contributions to renowned companies such as Intel Corporation and IBM. While more specific details about his work at these organizations are not available, his association with industry leaders indicates his invaluable expertise and substantial contributions to technological advancements.

Collaborations:

Throughout his career, Ma has had the opportunity to collaborate with accomplished professionals in the industry. Notably, he has worked alongside Valluri Ramana Rao and Li-Peng Wang, demonstrating a commitment to teamwork and knowledge exchange. These collaborations likely played a pivotal role in fostering technological innovation and facilitating the development of cutting-edge solutions.

Conclusion:

Qing Ma's extensive patent portfolio and contributions to semiconductor packaging and MEMS switches exemplify his profound impact on the field. His ability to advance technologies related to air pressure sensing and optimize the functionality of electronic devices through inventive packaging techniques highlight Ma's ingenuity. As he continues to explore new frontiers, we eagerly anticipate further innovations from this remarkable inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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