The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Sep. 21, 2012
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Weng Hong Teh, Phoenix, AZ (US);
Kevin Lin, Beaverton, OR (US);
Feras Eid, Chandler, AZ (US);
Qing Ma, Saratoga, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 1/02 (2006.01); H01L 25/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); H01L 25/50 (2013.01); H05K 1/0212 (2013.01); H05K 1/185 (2013.01); H05K 3/0097 (2013.01); H05K 2201/097 (2013.01); H05K 2203/1536 (2013.01); H05K 2203/308 (2013.01); Y10T 29/4913 (2015.01);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.