Phoenix, AZ, United States of America

Weng Hong Teh

USPTO Granted Patents = 43 

 

Average Co-Inventor Count = 2.8

ph-index = 10

Forward Citations = 367(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2014 - 2021)
  • Cambridge, MA (US) (2016 - 2024)

Company Filing History:


Years Active: 2014-2025

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43 patents (USPTO):

Title: Weng Hong Teh: Innovator in High-Density Substrate Technology

Introduction: Weng Hong Teh is a prominent inventor based in Phoenix, AZ, whose contributions to technology are illustrated by an impressive portfolio of 42 patents. As a key member of the Intel Corporation, he stands at the forefront of advancements in semiconductor packaging and interconnect technology.

Latest Patents: One of Weng Hong Teh's latest patents is focused on "High density substrate routing in package." This invention involves devices that incorporate high-density interconnects between semiconductor dice. In various embodiments, the invention describes a bumpless buildup layer (BBUL) substrate that houses a first die, which is partially embedded in the substrate, featuring multiple high-density interconnect pads. A second die is also at least partially embedded within the BBUL substrate, equipped with its own set of high-density interconnect pads. Furthermore, a high-density interconnect element is embedded within the BBUL substrate, containing additional high-density interconnect pads that create electrical connections between the first and second sets of pads.

Career Highlights: Weng Hong Teh’s career at Intel Corporation has been marked by innovative breakthroughs in semiconductor technologies. His expertise in high-density interconnects is pivotal in creating compact and efficient electronic devices, contributing to the evolution of modern computing.

Collaborations: Throughout his career, Weng Hong Teh has collaborated with notable colleagues, including Chia-Pin Chiu and Feras Eid. Together, they have worked on various projects that enhance the functionality and performance of semiconductor products, driving forward advancements in the industry.

Conclusion: With 42 patents to his name, Weng Hong Teh has made significant strides in the field of high-density substrate technology. His innovative work at Intel Corporation and collaborations with fellow inventors underscore his vital role in shaping the future of semiconductor design and manufacturing.

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