The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Nov. 24, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kevin L. Lin, Beaverton, OR (US);
Qing Ma, Saratoga, CA (US);
Feras Eid, Chandler, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Weng Hong Teh, Phoenix, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0042 (2013.01); B81B 7/0058 (2013.01); B81B 7/0077 (2013.01); B81C 1/00246 (2013.01); G01L 9/007 (2013.01); G01L 9/0047 (2013.01); G01L 9/0073 (2013.01); H01L 24/19 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); H01L 29/84 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/18162 (2013.01);
Abstract
A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity.