Johanna M Swan

Scottsdale, AZ, United States of America

Johanna M Swan

This inventor holds 318 USPTO granted patents and 102 published patent applications and 8 EPO patents, primarily in Microelectronic Packaging (CPC class H01L24-16). Top assignees: Intel Corporation, Mobileye Vision Technologies Ltd., Santa Clara. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Johanna M Swan. Retrieved from https://idiyas.com/inventor/johanna-m-swan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 318 

% Patents Active = 88.1

 

Average Co-Inventor Count = 4.9

ph-index = 15

Forward Citations = 1,611(Granted Patents)

Forward Citations (Not Self Cited) = 1,379(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:


Years Active: 2003-2026

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Areas of Expertise:
Microelectronic Assemblies
Thermal Management
Quasi-Monolithic Architectures
High-Speed Signal Traces
Power Delivery Structures
Hybrid Bonding
Integrated Circuit Devices
Interconnect Features
Die Stacks
Communication Networks
Cooling Technologies
Skip Level Vias
318 patents (USPTO):Explore Patents

Title: Johanna Swan: Pioneering Innovations in IC Chip Technology

Introduction:

Johanna Swan, a prominent inventor based in Scottsdale, AZ, has made significant contributions to the field of Integrated Circuit (IC) design and development. With an impressive portfolio of 216 patents, Swan has been at the forefront of advancements in composite IC chip technology. This article delves into Swan's latest patents, career highlights, notable collaborations, and his invaluable contributions to the industry.

Latest Patents:

Swan's recent patents highlight his expertise in the development of composite IC chips. In particular, his innovative work involves embedding chiplets within the metallization layers of host IC chips. By interconnecting passive and active devices, this technology enables the creation of complex circuitry in a compact and efficient manner. Swan's patents also emphasize the use of additional metallization layers and dielectric materials to fabricate high-performance composite IC chip structures. Notable examples include "Composite IC chips including a chiplet embedded within metallization layers of a host IC chip" and "Vias in composite IC chip structures."

Career Highlights:

Swan's distinguished career has been primarily associated with renowned companies such as Intel Corporation and Others (referring to various entities in the industry). At each of these companies, Swan's expertise has been instrumental in driving innovations and pushing the boundaries of IC chip technology. His relentless pursuit of excellence is evident in his extensive patent portfolio, which showcases his commitment to advancing the field.

Collaborations:

Throughout his career, Swan has had the privilege of collaborating with numerous talented professionals. Notably, he has worked closely with esteemed colleagues such as Adel Elsherbini and Feras Eid. These collaborations have allowed Swan to combine his expertise with other innovative minds, resulting in groundbreaking advancements in the field of IC chip technology. The collective efforts of these collaborations have undoubtedly contributed to the rapid evolution of the industry.

Conclusion:

Johanna Swan's exceptional patent portfolio and career accomplishments solidify his status as a leading figure in IC chip innovation. His pioneering work in composite IC chip technology, particularly in embedding chiplets within host IC chips, has opened new avenues for circuit design and integration. Swan's collaborations with esteemed colleagues have further enriched his contributions to the field. By revolutionizing IC chip technology, Swan continues to drive industry advancements and shape the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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