The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Aug. 19, 2022
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Chandler, AZ (US);
David Hui, Santa Clara, CA (US);
Haris Khan Niazi, Scottsdale, AZ (US);
Wenhao Li, Chandler, AZ (US);
Bhaskar Jyoti Krishnatreya, Hillsboro, OR (US);
Henning Braunisch, Phoenix, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Jiraporn Seangatith, Chandler, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Krishna Vasanth Valavala, Chandler, AZ (US);
Xavier Francois Brun, Hillsboro, OR (US);
Feras Eid, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.