logo

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Wenhao Li

LinkedIn

This inventor holds 13 USPTO granted patents and 25 published patent applications. Top assignee: Intel Corporation. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenhao Li. Retrieved from https://idiyas.com/inventor/wenhao-li-sjomyqk5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 38.5

Average Co-Inventor Count = 5.4

ph-index = 1


Company Filing History:

goldMedal13 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2025-2026

Loading Chart...
13 patents (USPTO):Explore Patents
1. 12745642 - Device, method, and system to mitigate warpage of a composite chiplet (2026-09-22),
2. 12707932 - Handling assembly, handling system and method (2026-08-11),
3. 12631837 - Photonic quasi-monolithic die architectures (2026-05-19),
4. 12610817 - Metal matrix composite layers for heat dissipation from integrated circuit devices (2026-04-21),
5. 12604754 - Package structures with non-uniform interconnect features (2026-04-14),
6. 12604733 - Package structures with collapse control features (2026-04-14),
7. 12600159 - Reusable composite stencil for spray processes (2026-04-14),
8. 12598989 - Package structures with patterned die backside layer (2026-04-07),
9. 12550781 - Template structure for quasi-monolithic die architectures (2026-02-10),
10. 12532740 - Porous mesh structures for the thermal management of integrated circuit devices (2026-01-20),
11. 12532739 - Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devices (2026-01-20),
12. 12438087 - High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries (2025-10-07),
13. 12431430 - Technologies for high throughput additive manufacturing for integrated circuit components (2025-09-30),

Title: Innovations of Inventor Wenhao Li

Introduction

Wenhao Li is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of additive manufacturing, particularly in the context of integrated circuit components. With a total of 13 patents, his work is paving the way for advancements in technology.

Latest Patents

Wenhao Li's latest patents focus on high throughput additive manufacturing (HTAM) for integrated circuit components. One of his patents describes a method where a sacrificial dielectric is formed to create a negative mask for patterning conductive traces using HTAM. Another embodiment involves the use of a permanent dielectric that is patterned through processes such as laser project patterning. Additionally, he has developed techniques for patterning conductive traces with tapered sidewalls, followed by the deposition of a buffer layer and HTAM layer on top. These innovations are crucial for enhancing the efficiency and effectiveness of manufacturing processes in the electronics industry.

Career Highlights

Wenhao Li is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative work. His expertise in high throughput additive manufacturing has positioned him as a key player in the development of advanced manufacturing techniques.

Collaborations

Wenhao has collaborated with notable colleagues such as Yoshihiro Tomita and Aleksandar Aleksov. Their combined efforts contribute to the advancement of technologies in the field of additive manufacturing.

Conclusion

Wenhao Li's contributions to high throughput additive manufacturing are noteworthy and reflect his dedication to innovation. His patents and work at Intel Corporation are instrumental in shaping the future of integrated circuit manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…