= 0.66 Inventors with similar research interests:
Company Filing History:
Years Active: 2014-2025
Title: Feras Eid: A Brilliant Mind Revolutionizing Microelectronics at Intel Corporation
Introduction:
In the realm of microelectronics, Feras Eid's innovative contributions have been truly remarkable. Hailing from Chandler, Arizona, Feras has developed an impressive portfolio of 144 patents, showcasing his expertise in cutting-edge technologies. Working alongside esteemed colleagues at Intel Corporation, Feras has played a pivotal role in advancing the field of microelectronics, particularly in the areas of electrostatic discharge (ESD) protection and mold-integrated components. Let's delve into the world of Feras Eid and explore his latest patents, career highlights, and collaborations.
Latest Patents:
Feras Eid's recent patents highlight his profound knowledge and inventive prowess. Among his notable innovations is the "Microelectronic Package Electrostatic Discharge (ESD) Protection." This patent introduces a microelectronic package comprising a conductive ground path and an ESD protection material. This groundbreaking development ensures the safe passage of electrical signals in microelectronic packages.
Another significant patent by Feras is the "Microelectronic Package with Mold-Integrated Components." This invention incorporates an overmold material, a redistribution layer (RDL), and a die in the overmold material. The RDL facilitates electrical interconnection within the overmold material, enhancing the performance and reliability of microelectronic packages.
Career Highlights:
Feras Eid's association with Intel Corporation has proved instrumental in driving advancements in microelectronics. Through his exceptional research and innovative thinking, he has significantly contributed to enhancing the performance, durability, and overall functionality of microelectronic devices.
His extensive patent portfolio is a testament to his commitment to technological advancement and his contributions to Intel's success. Feras continues to push the boundaries of microelectronics, continually improving the industry's standards.
Collaborations:
Feras Eid has had the privilege of collaborating with esteemed colleagues in his journey to revolutionize microelectronics. Two notable collaborators include Johanna Swan and Adel Elsherbini, who have worked alongside Feras at Intel Corporation.
Johanna Swan, known for her expertise in materials science, has brought significant insights to Feras's projects. Together, they have successfully merged material science with microelectronics to develop groundbreaking solutions.
Adel Elsherbini, a seasoned professional in microelectronic packaging, has partnered with Feras to develop cutting-edge mold-integrated components. Their collaboration has resulted in patents that have revolutionized the field of microelectronics and paved the way for future advancements.
Conclusion:
Feras Eid's transformative patents and contributions within the world of microelectronics have solidified his position as an invaluable asset to Intel Corporation. His groundbreaking innovations in ESD protection and mold-integrated components have improved the performance and reliability of microelectronic packages. Collaborating alongside brilliant minds like Johanna Swan and Adel Elsherbini, Feras continues to push the boundaries of what is possible in microelectronics. As Feras Eid's journey unfolds, we eagerly anticipate witnessing the incredible innovations he will pioneer in the future.
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