The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Aug. 19, 2022
Intel Corporation, Santa Clara, CA (US);
Adel Elsherbini, Chandler, AZ (US);
Beomseok Choi, Chandler, AZ (US);
Feras Eid, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Shawna Liff, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A multichip composite device includes on- and off-die metallization layers, inorganic dielectric material, and stacked hybrid-bonded dies. On-die metallization layers may be thinner than off-die metallization layers. The multichip composite device may include a structural substrate. Off-die metallization layers may be above and below the stacked hybrid-bonded dies. A substrate may couple the multichip composite device to a power supply in a multichip system. Forming a multichip composite device includes hybrid bonding dies and forming inorganic dielectric material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile